Materials issues and characterization of low-k dielectric materials

MRS Bulletin

Volumn 22, Issue 10, 1997, Pages 49-54

  Ryan, E Todd ^a   McKerrow, Andrew J ^a   Leu, Jihperng ^a   Ho, Paul S ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; INTEGRATED CIRCUIT MANUFACTURE; MECHANICAL PROPERTIES; PERMITTIVITY; SILICA; THERMODYNAMIC PROPERTIES; THIN FILMS;

INTERLAYER DIELECTRICS; LOW DIELECTRIC MATERIALS;

DIELECTRIC MATERIALS;

EID: 0001538906     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/s0883769400034205     Document Type: Article

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