Effect of post-pattern annealing on the grain structure and reliability of Al-based interconnects

Journal of Applied Physics

Volumn 79, Issue 11, 1996, Pages 8330-8335

  Kang, S H ^a   Kim, C ^a   Morris Jr , J W ^a   Genin F Y ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0009186144     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.362545     Document Type: Review

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