Aluminum wiring reliability of fluorinated amorphous carbon interlayer

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 341-346

  Iguchi, M ^a   Matsubara, Y ^a   Ito, S ^a   Endo, K ^a   Koyanagi, K ^a   Kishimoto, K ^a   Gomi, H ^a   Tatsumi, T ^a   Horiuchi, T ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; AMORPHOUS FILMS; CAPACITANCE; CURRENT DENSITY; ELECTROMIGRATION; FLUOROCARBONS; PERMITTIVITY; SILICA; SUBSTRATES; THERMAL CONDUCTIVITY;

ALUMINUM WIRING; FLUORINATED AMORPHOUS CARBON; INTERLAYER DIELECTRICS; JOULE HEATING;

DIELECTRIC MATERIALS;

EID: 0032296711     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-341     Document Type: Conference Paper

References (5)