In situ STM study of Cu and Ni electrodeposition

Materials Research Society Symposium Proceedings

Volumn 404, Issue , 1996, Pages 3-8

  Moffat, T P ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL ORIENTATION; CRYSTALLIZATION; DESORPTION; ELECTROLYTIC POLISHING; MULTILAYERS; NICKEL; PHOSPHORIC ACID; SCANNING TUNNELING MICROSCOPY; STABILITY; SURFACES; X RAY DIFFRACTION;

ADLATTICE; ELECTROCRYSTALLIZATION; FRIZZY; IMMERSION;

ELECTRODEPOSITION;

EID: 0029710612     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)