Plasma enhanced chemical vapor deposition of fluorocarbon thin films via CF3H/H2 chemistries: power, pressure, and feed stock composition studies

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 2, 2000, Pages 377-384

  Senkevich, Jay J ^a,b   Sherrer II, David W ^a  

^a ACT MicroDevices   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; COMPOSITION EFFECTS; CROSSLINKING; FEEDSTOCKS; FLUOROCARBONS; HYDROGEN; HYDROPHOBICITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PRESSURE EFFECTS; REFRACTIVE INDEX; STRUCTURE (COMPOSITION); TENSILE STRESS;

COEFFICIENT OF FRICTION; CROSSLINKING DENSITY; FLUOROCARBON THIN FILMS; INTRINSIC STRESS; RADIO FREQUENCY POWER DENSITY;

THIN FILMS;

EID: 0034156441     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582196     Document Type: Article

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