Plasma-enhanced chemical vapor deposition of fluorocarbon films with high thermal resistance and low dielectric constants

Journal of the Electrochemical Society

Volumn 144, Issue 5, 1997, Pages 1797-1802

  Takeishi, S ^a   Kudo, H ^a   Shinohara, R ^a   Hoshino, M ^a   Fukuyama, S ^a   Yamaguchi, J ^a   Yamada, M ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DECOMPOSITION; DIELECTRIC FILMS; DIELECTRIC PROPERTIES; FLUOROCARBONS; GLASS TRANSITION; PLASMA APPLICATIONS;

FLUOROCARBON FILMS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

COATINGS;

EID: 0031143060     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837682     Document Type: Article

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