Nanometer-scale copper electrodeposition from an on-chip source

IEEE Electron Device Letters

Volumn 21, Issue 6, 2000, Pages 277-279

  Wu, Mingshaw W ^a   Sohn, Lydia L ^a  

^a PRINCETON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; COPPER; ELECTRIC CONDUCTANCE; MICROPROCESSOR CHIPS;

ATOMIC REARRANGEMENT;

ELECTROPLATING;

EID: 0033746558     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.843149     Document Type: Article

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