Evolution of the growth front for copper electrodeposition followed by real time imaging

Langmuir

Volumn 14, Issue 15, 1998, Pages 4308-4314

  Schilardi, P ^a   Mendez S ^a   Salvarezza, R C ^a   Arvia, A J ^a  

^a FACULTAD DE CIENCIAS EXACTAS   (Argentina)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ACTIVATION; ELECTROLYTIC CELLS; ELECTROPLATING; GROWTH (MATERIALS); IMAGING TECHNIQUES; MATHEMATICAL MODELS; REACTION KINETICS; SULFUR COMPOUNDS; SURFACE PHENOMENA; SURFACE ROUGHNESS;

EDWARDS-WILKINSON EQUATION; OHMIC OVERPOTENTIALS; THIOUREA;

COPPER PLATING;

EID: 0032115727     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la971358k     Document Type: Article

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