Stress-buffer and passivation processes for si and gaas 1c's and passive components using photosensitive bcb: process technology and reliability data

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 487-498

  Garrou, Phillip E ^a  

^a Dow Chemical   (United States)

Author keywords

Air bridges; Gaas; Integrated passives; Passivation; Passives; Photo bcb; Resistor nets; SBL; Stress buffer layer

Indexed keywords

ELECTRONICS PACKAGING; PASSIVATION; PHOTOSENSITIVITY; RANDOM ACCESS STORAGE; SEMICONDUCTING GALLIUM ARSENIDE;

BENZOCYCLOBUTENES (BCB); STRESS BUFFER LAYERS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033334327     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784503     Document Type: Article

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