Versatile mutilayer MCM-D structure for high reliability applications

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging

Volumn 20, Issue 3, 1997, Pages 327-333

  Strandberg, Jan ^a   Thiede, Heike ^a   Karlsson, Anita ^a   Bodo, Peter ^a   Haglund, Joacim ^a   Valizadeh, Sima ^a   Weiland, Anders ^a  

^a ACREO AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE STRUCTURES; SOLDERING; STRESS ANALYSIS; THERMAL CYCLING; THERMAL STRESS;

MULTILAYER MULTICHIP STRUCTURES;

MULTICHIP MODULES;

EID: 0031197604     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.618233     Document Type: Article

References (0)