Twinstar - Dual pentium© processor module

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 4, 1996, Pages 358-362

  Skinner, Michael P ^a,d,e,f   Castillo, Daniel ^a,g   Cummings, Scott ^a,c,f,h,i,j   Garrou, Philip E ^{a,f,k,l,m,n,o}   Chazan, David ^b,n,p,q,r   Liu, Ken ^{b,g,j,s,t,u,v,w}   Reinschmidt, Robert ^b   Westbrook, Scott ^{b,f,g,j,n,x,y}   Ho, Chung ^b,p   Rogers, W Boyd ^c  

^a DOW CHEMICAL COMPANY   (United States)

^b MicroModule Systems   (United States)

^c MCNC   (United States)

^d POLYTECHNIC UNIVERSITY   (United States)

^e IBM   (United States)

^f Electron Beam Lithography ^*

^g HEWLETT PACKARD COMPANY   (United States)

^h VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

ⁱ DOW CHEMICAL

^j MicroModule Systems

^k Dow's Ctrl Res and New Bus Org

^l National Technical Committee

^m ISHM Materials Division

ⁿ IEEE

^o Department of TC 5

^p UNIVERSITY OF CALIFORNIA   (United States)

^q Raychem Corporation   (United States)

^r American Vacuum Society

^s NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^t UNIVERSITY OF HOUSTON   (United States)

^u Multichip Module Business Unit

^v Trilogy Systems Corporation

^w Amdahl Corporation   (United States)

^x MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^y Trilogy Systems

more..

Author keywords

Benzocyclobutene (BCB); Multichip Module (MCM); Process; Reliability

Indexed keywords

ALUMINUM; PROGRAM PROCESSORS; RELIABILITY; SUBSTRATES; WSI CIRCUITS;

BENZOCYCLOBUTENE; PROCESSOR MODULE;

MULTICHIP MODULES;

EID: 0030380495     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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2. S. Abasi, et. al., "The Technology and Manufacture of the Vax- 9000 Multichip Unit," Multichip Modules: The Basics, Doane and Franzione Eds., Van Nostrand, pg. 769, 1993.
3. A. Shliemoun, M. McGraw, B. Griswald, C. Ho, and S. Westbrook, "Thin Profile MCM-D Packaging for Small Form Factor Applications," Proceeding of the International MCM Conference, Denver, Colorado, pg. 461, 1994.
4. R.H. Heistand, D.C. Frye, D.C. Burdeaux, J.N. Carr, and P.E. Garrou, "Economic Evaluation of Deposited Dielectric MCM Manufacturing Costs," Proceedings of the International Conference on MCMs, Denver, Colorado, pg. 441, 1993.
5. P.E. Garrou, et. al., "Cost Modeling & Fabrication of MCMs using Photosensitive Cyclotene™ (BCB)," Proceedings of the International Microelectronics System Technology Symposium, Berlin, Germany, pg. 569, 1994.
6. A. Strandjord, Y. Ida, P. Garrou, B. Rogers, S. Cummings, and S. Kisting, "MCM-D Fabrication with photo-BCB: Processing, Solder Bumping, Systems Assembly and Testing," Proceedings of the International Symposium on Microelectronics (ISHM), pg. 402, 1995.
7. G. Adema, L. Hwang, G. Rinne, and I. Turlik, "Passivation Schemes for Cu/PI Thin Film Interconnects," Proceedings of the ECTC, pg. 776, 1992.
8. T. Shimoto, K. Matsui, and K. Utsumi, "Cu/photoBCB Thin Film Multilayer for High Performance MCMs," International Conference on MCMs, Denver, Colorado, pg. 115, 1994.
9. K. Matsui, T. Shimoto, Y. Shimada, and K. Utsumi, "MCM D/L Technology Based on Cu/BCB Thin Film Multilayers," Proceedings of the International Symposium on Microelectronics (ISHM), pg. 396, 1995.