Process optimization and systems integration of a copper/photosensitive benzocyclobutene MCM-D: Dielectric processing, metallization, solder bumping, device assembly, and testing

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 3, 1996, Pages 260-279

  Strandjord, Andrew J G ^a,b,d,e,f   Scheck, Daniel M ^a   Kisting, Scott R ^a   Rogers, W Boyd ^b   Garrou, Philip E ^b,d,j,k,l,m   Ida, Yasunobu ^b,c,g,h,i   Cummings, Scott L ^a  

^a DOW CHEMICAL COMPANY   (United States)

^b MCNC   (United States)

^c Dow Chemical Japan Ltd   (Japan)

^d Dow Chemical Japan Ltd ^*

^e LUTHER COLLEGE   (United States)

^f UNIVERSITY OF MINNESOTA   (United States)

^g Dow Chem's Electron Mat Group

^h TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

ⁱ Dow Mitsubishi Chemical Ltd   (Japan)

^j NORTH CAROLINA STATE UNIVERSITY   (United States)

^k INDIANA UNIVERSITY   (United States)

^l IEEE

^m ISHM Materials Division

more..

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COATING TECHNIQUES; FLIP CHIP DEVICES; HEAT TREATMENT; MULTICHIP MODULES; OPTIMIZATION; PLASTICS; SOLDERING; SURFACES; SYNTHESIS (CHEMICAL); TESTING;

BENZOCYCLOBUTENE; BUMP TRANSFER PROCESS; DIELECTRIC PROCESSING; MINIMUM PITCH; SOLDER BUMPING; SYSTEMS INTEGRATION;

MICROELECTRONIC PROCESSING;

EID: 3343018381     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (65)

1. T. Tessier and E. Myszka, "Approaches to Cost Reducing MCM-D Substrates," Proceedings of 43rd ECTC, Orlando, Florida, pp. 570-578, June 1-4, 1993.
2. R.H. Heistand, D.C. Frye, D.C. Burdeaux, J.N. Carr, and P.E. Garrou, "Economic Evaluation of Deposited Dielectric MCM Manufacturing Costs," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS, Denver, Colorado, pp. 441-450, April 14-16, 1993.
3. P.E. Garrou and I. Turlik, "Materials of Construction: Substrate Dielectric, Metallization," Thin Film Multichip Modules, G. Messner, I. Turlik, J.W. Balde, and P.E. Garrou, editors, ISHM Press, pp. 92-164, 1992.
4. T. Watari and H. Murano, "Packaging Technology for the NEC Sx Supercomputer," IEEE Transactions on CHMT, Vol. 8, pp. 462-465, 1985.
5. Y. Tsukuda, S. Tsuchida, and Y. Mashimoto, "Surface Laminar Circuitry Packaging," Proceedings of the 42nd ECTC, San Diego, California, pp. 22-27, May 18-20, 1992.
6. E.W. Rutter Jr., E.S. Moyer, R.F. Harris, D.C. Frye, V.L. St. Joer, and F.L. Oaks, "A Photodefinable Benzocyclobutene Resin for Thin Film Microelectronics Applications," Proceedings of 1st International Conference on Multichip Modules, ISHM/IEPS, Denver, Colorado, pp. 394-400, April 1-3, 1992.
7. E.S. Moyer, E.W. Rutter Jr., M.T. Bernius, P.H. Townsend, R.F. Harris, H. Pranjoto, and D.D. Denton, "Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronics Applications: Part II," Proceedings IEPS, Austin, Texas, pp. 37-50, November 1992.
8. E.S. Moyer, G.S. Becker, E.W. Rutter, Jr., M. Radler, J.N. Bremmer, M.T. Bernius, D. Castillo, A.J.G. Strandjord, R. Heistand, P. Foster, and R. F. Harris, "Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronics Applications. III. 1 To 20 Micron Patterned Films," MRS Symposium Proceedings, Boston, Massachusetts, Vol. 323, pp. 267-276, November 29-December 3, 1993.
9. A.J.G. Strandjord, P.E. Garrou, R.H. Heistand, and T.G. Tessier, "MCM-LD: Large Area Processing Using Photosensitive-BCB," IEEE Transactions on CHMT, Part B, Vol. 18, No. 2, pp. 269-276, May 1995.
10. A.J.G. Strandjord, R.H. Heistand, J.N. Bremmer, P.E. Garrou, and T.G. Tessier, "A Photosensitive-BCB on Laminate Technology (MCM-LD)," Proceedings of 44th ECTC, Washington, D.C., pp. 374-386, May 1-4, 1994.
11. T. Shimoto, K. Matsui, and K. Utsumi, "Cu / Photosensitive-BCB Thin Film Multilayer Technology for High-Performance Multichip Module," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS Denver, Colorado, pp. 115-120, April 13-15, 1994.
12. K. Matsui, T. Shimoto, Y. Shinada, and K. Utsumi, "MCM-D/L Technology Based on Cu/Benzocyclobutene Thin Film Multilayer Structure," Proceedings of the International Conference on Microelectronics (ISHM), Los Angeles, California, pp. 396-401, October 24-26, 1995.
13. W. Radik, K. Plehnert, M. Zellner, A. Achen, R.H. Heistand, D. Castillo, and R. Urscheler, "MCM-D Technology for a Communication Application," Proceedings of the International Conference on Multichip Modules, ISHM/ IEPS, Denver, Colorado, pp. 402-409, April 13-15, 1994.
14. M.P. Skinner, D. Castillo, S. Cummings, P.E. Garrou, K. Liu, D. Chazan, R. Reinschmidt, S. Westbrook, C. Ho, and W.B. Rogers, "TwinStar - Dual Pentium Processor Module," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS, Denver, Colorado, pp. 75-81, April 17-19, 1996.
15. J. Simon, G. Chmiel, R. Leutenbauer, and H. Reichl, "The Development of a FC-BGA," Proceedings of the International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium, Silicon Valley, California, February 13-16, 1996.
16. A.J.G. Strandjord, Y. Ida, P.E. Garrou, W. B. Rogers, S.L. Cummings, and S.R. Kisting, "MCM-D Fabrication with Photosensitive Benzocyclobutene: (Processing, Solder Bumping, Systems Assembly, and Testing)," Proceedings of the International Symposium on Microelectronics (ISHM), Los Angeles, California, pp. 402-417, October 24-26, 1995.
17. Y. Ida, P.E. Garrou, A.J.G. Strandjord, S.L. Cummings, W.B. Rogers, M.J. Berry, and S.R. Kisting, "Processing, Transfer Bumping, Chip Attachment, and Testing of a Thin Film Cu / Photo-BCB MCM-D," Proceedings of 1995 Japan IEMT Symposium, Omiya, Japan, pp. 441-444, December 4-6, 1995.
18. R. Chanchani, K. Treece, and P. Dressendorfer, "A New Mini Ball Grid Array (mBGA) Multichip Module Technology," Proceedings of the International Symposium on Microelectronics (ISHM), Boston, Massachusetts, pp. 196-201, November 15-17, 1994.
19. R.A. Kirchhoff and K.J. Bruza, "Benzocyclobutenes in Polymer Synthesis," Prog. Polymer Science, Vol. 18, pp. 85-185, 1993.
20. D. Solomon, S. El Kilani, F.L. David, and M. Lubbers, "Test Vehicle Characterization of MCM-D Interconnects," Proceedings of the International Symposium on Microelectronics (ISHM), Dallas, Texas, pp. 324-331, November 9-11, 1993.
21. F. Gong, J. Strandberg, H. Theide, H. Hentzell, H. Hesselboom, and W. Karner, "Investigation of High Speed Pulse Transmission in MCM-D," IEEE Transactions on CHMT, Vol. 16, pp. 735-742, 1993.
22. P. Chinoy and J. Tajadod, "Processing and Microwave Characterization of Multilevel Interconnects Using BCB Dielectric," IEEE Transactions on CHMT, Vol. 16, No. 7, pp. 714-719, 1993.
23. H. Pranjoto and D.D. Denton, "Moisture Uptake of BisBenzocyclobutene (BCB) Films for Electronic Packaging Applications," MRS Symposium Proceedings, Boston, Massachusetts, Vol. 203, pp. 295-302, November 26-29, 1990.
24. P. Garrou, "Polymer Dielectrics for Multichip Module Packaging," Proceedings IEEE, Vol. 80, No. 12, pp. 1942-1954, December 1992.
25. P.H. Townsend, D. Schmidt, T.M. Stokich, S. Kisting, D.C. Burdeaux, D. Frye, M. Bernius, M. Lanka, and K. Berry, "Adhesion of CYCLOTENE (BCB) Coatings On Silicon Substrates," MRS Symposium Proceedings, Boston, Massachusetts, Vol. 323, pp. 365-370, November 29-December 3, 1993.
26. M.J. Berry, I. Turlik, P.L. Smith, and G.M. Adema, "The Role of Surface Modification on Adhesion at the Metal Polymer Interface," MRS Symposium Proceedings, Anaheim, California, Vol. 227, pp. 351-356, April 1991.
27. H.D. Conway and J.P.R. Thomsin, Journal of Adhesion Science Technology, Vol. 3, pp. 227-233, 1988.
28. P.H. Townsend, T.M. Stokich, B.S. Huber, "Mechanical Behavior of Benzocyclobutene Films on Silicon Substrates," MRS Symposium Proceedings, Anaheim, California, Vol. 226, pp. 215-221, April 1991.
29. T. Takahashi, M.G. Dibbs, and D.C. Frye, "Benzocyclobutene Resin for Thin Film Electronic Applications," Proceedings 3rd International SAMPE Symposium, Chiba, Japan, December 7-10, 1993.
30. Processing Guidelines for VM-651 and VM-652 Adhesion Promoters from Dupont, June 2, 1995.
31. C. R. Hodges, J. Hull, J. Strandberg, J. Hagel, H. Thiede, and A. Karisson, "Large Panel Format Multichip Module Substrates," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS, Denver, Colorado, pp. 125-133, April 14-16, 1993.
32. L. Laursen and P.E. Garrou, "Consortium for Intelligent Large Area Processing (CILAP), Program Review," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS, Denver, Colorado, pp. 553-558, April 19-21, 1995.
33. D.C. Frye, M.P. Skinner, R.H. Heistand, P.E. Garrou, and T.G. Tessier, "Cost Implications of Large Area MCM Processing," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS, Denver, Colorado, pp. 69-80, April 13-15, 1994.
34. M.G. Dibbs, P.H. Townsend, T.M. Stokich, B.S. Huber, C.E. Mohler, R.H. Heistand, P.E. Garrou, G.M. Adema, M.J. Berry, and I. Turlik, "Cure Management of Benzocyclobutene Dielectric for Electronic Applications," Proceedings of 6th International SAMPE Electronics Conference, Baltimore, Maryland, pp. 1-10, June 22-25, 1992.
35. P.H. Townsend, D.C. Burdeaux, T.M. Stokich and M.G. Dibbs, "Cure Technology for Controlled Stress in Thin Benzocyclobutene Coatings," MRS Symposium Proceedings, San Francisco, California, Vol. 264, pp. 135-140, April 27-30, 1992.
36. T. M. Stokich, C.C. Fulks, M.T. Bernius, D.C. Burdeaux, P.E. Garrou, and R.H. Heistand, "Planarization With Cyclotene 3022 (BCB) Polymer Coatings," MRS Symposium Proceedings, San Francisco, California, Vol. 308, pp. 517-526, April 12-16, 1993.
37. A. Schiltz, "A Review of Planar Technologies for Multichip Modules," IEEE Transactions on CHMT, Vol. 15, No. 2, pp. 236-243, April 1992.
38. G. Chmiel, M. Topper, C. Johren, and A. Achen, "Thin Film Multichip Modules - Process Development Using Photosensitive Benzocyclobutene," Micro System Technology 1994, VDE-Verlag GmbH, pp. 587-598, 1994.
39. D.J. Perettie, M.J. Radler, and T. Takahashi, "Benzocyclobutene as a Planarization Overcoat for Flat Panel Displays," Proceedings of the 15th International Display Research Conference, Hamamatsu, Japan, pp. 721-724, October 16-18, 1995.
40. E.D. Perfecto, D.G. Berger, C.T. Osborn, and G. White, "Engineering PSPI's for MCM-D Applications," International Journal of Microcircuits and Electronic Packaging, Vol. 16, No. 4, pp. 319-325, 1993.
41. E.D. Perfecto, C. Osborn, and D. Berger "Factors That Influence Photosensitive PI Lithographic Performance," Proceedings of the International Conference on MCMs, ISHM/ IEPS, Denver, Colorado, pp. 40-45, April 14-16, 1993.
42. Ed Rutter, The Dow Chemical Company, Personal Communication.
43. T.M. Stokich, D.C. Burdeaux, C.E. Mohler, P.H. Townsend, M.G. Dibbs, R.F. Harris, M.D. Joseph, C.C. Fulks, M.F. McCulloch, and R.M. Dettman, "Advances in Thermo-Oxidative Stabilization of DiVinyl Siloxane Bis-Benzocyclobutene Polymer Coatings," MRS Symposium Proceedings, San Francisco, California, pp. 275-280, April 1992.
44. H.E. Bair, B.J. Han, G.E. Johnson, and C.A. Pryde, "Curing Behavior and Oxidative Stability of a Benzocyclobutene Polymer," Proceedings of the Society of Plastics Engineers, ANTEC, Montreal, Canada, pp. 352-358, 1991.
45. R.H. Heistand II, R. DeVellis, T.A. Manial, A.P. Kennedy, T.M. Stokich, P.H. Townsend, P.E. Garrou, T. Takahashi, G.M. Adema, M.J. Berry, and I. Turlik, "Advances in MCM Fabrication With Benzocyclobutene (BCB) Dielectric," International Journal of Microcircuits and Electronic Packaging, Vol. 15, No. 4, pp. 183-94, 1992.
46. P.E. Garrou, R.H. Heistand, M. Dibbs, T.A. Manial, C. Mohler, T. Stokich, P.H. Townsend, G.M. Adema, M.J. Berry, and I. Turlik, "Rapid Thermal Curing of BCB Dielectric," Proceedings of 42nd ECTC, San Diego, California, pp. 770-76, May 1992.
47. C.E. Mohler, A.J.G. Strandjord, D.W. Castillo, M.R. Stachowiak, R.H. Heistand, P.E. Garrou, and T.G. Tessier, "Micro-ATR-IR as a Probe of BCB Layers for MCM-D/L Applications," MRS Symposium Proceedings, Boston, Massachusetts, Vol. 323, pp. 295-300, November 29 - December 3, 1993.
48. T.M. Stokich, W.M. Lee, and R.A. Peters, "Real Time FT-IR Studies of the Reaction Kinetics for the Polymerization of Divinyl Siloxane Bis-Benzocyclobutene Monomers," MRS Symposium Proceedings, Anaheim, Vol. 227, pp. 103-114, April 1991.
49. P.E. Garrou, R.H. Heistand, M.G. Dibbs, T.A. Manial, C.E. Mohler, T.M. Stokich, P.H. Townsend, G. M. Adema, M.J. Berry, and I. Turlik, "Rapid Thermal Curing of BCB Dielectric," IEEE Transactions on CHMT, Vol. 16, No. 1, pp. 46-51, February 1993.
50. T.C. Hodge, B. Landmann, S.A. Bidstrup, and P.A. Kohl, "Rapid Thermal Curing of Polymer Interlayer Dielectrics," International Journal of Microcircuits and Electronic Packaging, Vol. 17, No. 1, pp. 10-20, 1994.
51. B. Rogers, M.J. Berry, I. Turlik, P. Garrou, and D. Castillo, "Soft Mask for Via Patterning in Benzocyclobutene," Proceedings of the International Symposium on Microelectronics (ISHM), Dallas, Texas, pp. 187-192, November 9-11, 1993.
52. P.B. Chinoy, "Processing and Electrical Characterization of Multilayer Metallization for Microwave Applications," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS Denver, pp. 203-208, April 19-21, 1995.
53. M. Schier, "Reactive Ion Etching of Benzocyclobutene Using a Silicon Nitride Dielectric Etch Mask," Journal of the Electrochemical Society, Vol. 142, No. 9, pp. 3238-3240, September 1995.
54. Y.T. Lii and J. Wetzel, "Low Dielectric Dow Cyclotene 3022 (BCB) Etch for Multilevel Interconnection Integration," Proceedings Electrochemical Society (VLSI Science and Technology), pp. 266-74, 1995.
55. S. Jones, R. Chapman, and E. Pavelchek, "Image Reversal: A Practical Approach to Lift-Off," Proceedings of SPIE, Vol. 771, pp. 231-241, 1987.
56. T.G. Tessier and P.E. Garrou, "Overview of MCM Technologies: MCM-D," Proceedings of the International Symposium on Microelectronics, San Francisco, California, pp. 235-247, October, 1992.
57. The tape peel tests were performed following the protocol established in ASTM Standard D3359-93.
58. T.G. Tessier and G. Chandler, "Compatibility of Common MCM-D Dielectrics With Scanning Laser Ablation Via Generation Processes," IEEE Transactions on CHMT, Vol. 16, No. 1, pp. 39-45, February 1993.
59. T. Shimoto, M. Matsui, M. Kimura, and K. Utsumi, "High Density Multilayer Substrates Using Benzocyclobutene Dielectric," Proceedings 7th IMC, Pacifico, Tokohama, pp. 325-330, 1992.
60. G.M. Adema, C.J. Berry, N.G. Koopman, G.A. Rinne, E.K. Yung, and I. Turlik, "Flip Chip Technology: A Method for Providing Known Good Die With High Density Interconnections," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS Denver, Colorado, pp. 41-49, April 13-15, 1994.
61. J. Wolf and M. Topper, "Alternative Solder Deposition Using Transfer Technique," Proceedings of the International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium, Silicon Valley, California, February 13-16, 1996.
62. J. Simon, M. Topper, H. Reichl, and G. Chmiel, "A Comparison of Flip Chip Technology With Chip Size Packages," Proceedings of the 1995 IEPC, San Diego, CA, pp. 665-674, September 24-27, 1995.
63. R.A. DeVries, R.A. Shick, and B.K. Johnson, "Digital Optical Imaging of Benzocyclobutene (BCB) Thin Films on Silicon Wafers," Proceedings of Materials Research Symposium, Pittsburgh, Pennsylvania, Vol. 381, pp. 165-173, April 17-19, 1995.
64. P. Magill and J. Powell, "Extending Applications of Automatic Optical Inspection," Proceedings of the International Conference on Multichip Modules, ISHM/IEPS Denver, Colorado, pp. 552-557, April 14-16, 1993.
65. R. Foster, "Photoimageable BCB Technology Lowers Costs for MCMs," Solid State Technology, Vol. 38, No. 6, pp. 125-130, June 1995.