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Volumn , Issue , 1994, Pages 115-120

Cu/Pilotosensitive-BCB thin-film multilayer technology for high-performance multichip module

Author keywords

Benzocyclobutene; MCM D; Multicliip module; Photosensitive; RISC module

Indexed keywords

FILM PREPARATION; LIGHT SENSITIVE MATERIALS; MICROPROCESSOR CHIPS; MICROSTRIP LINES; MULTILAYERS; PHOTOSENSITIVITY;

EID: 84994411521     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1994.753538     Document Type: Conference Paper
Times cited : (17)

References (8)
  • 3
    • 0009113329 scopus 로고
    • Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Application: Part 2
    • E.S.Moyer, E.W.Rutter, M.T.Bernius, P.H. Townsend and R.F.Harris, "Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Application: Part 2", in Proc. 12th IEPS Conf, pp37-50 (1992)
    • (1992) Proc. 12th IEPS Conf , pp. 37-50
    • Moyer, E.S.1    Rutter, E.W.2    Bernius, M.T.3    Townsend, P.H.4    Harris, R.F.5
  • 5
    • 0024908413 scopus 로고
    • Polymer Dielectric Options for Thin Film Packaging Application
    • T.G.Tessier, G.M.Adema and I.turlik, "Polymer Dielectric Options for Thin Film Packaging Application", in Proc. 39th ECC, pp 127-134 (1989)
    • (1989) Proc. 39th ECC , pp. 127-134
    • Tessier, T.G.1    Adema, G.M.2    Turlik, I.3
  • 6
    • 33749970389 scopus 로고
    • High Density Multilayer Substrate for Si on Si High Speed Module
    • M.Kimura, T.Shimoto, K.Matsui and K. Utsumi, "High Density Multilayer Substrate for Si on Si High Speed Module", in Proc. IEMT Symposium., pp 353-357 (1992)
    • (1992) Proc. IEMT Symposium , pp. 353-357
    • Kimura, M.1    Shimoto, T.2    Matsui, K.3    Utsumi, K.4
  • 8
    • 0027812446 scopus 로고
    • High Performance MCM-L/D Substrate Approaches for Cost-Sensitive Packaging Application
    • T.G.Tessier and E.G.Myszka, "High Performance MCM-L/D Substrate Approaches for Cost-Sensitive Packaging Application", in Proc. 3rd ICEMM., pp200-207 (1993)
    • (1993) Proc. 3rd ICEMM , pp. 200-207
    • Tessier, T.G.1    Myszka, E.G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.