Processing mechanics for flip-chip assemblies

Computers and Structures

Volumn 71, Issue 4, 1999, Pages 457-468

  Wang, J ^a   Ren, W ^a   Zou, D ^a   Qian, Z ^a   Liu, S ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; FABRICATION; FINITE ELEMENT METHOD; NUMERICAL ANALYSIS; RESIDUAL STRESSES;

FLIP CHIP ASSEMBLIES; MOIRE INTERFEROMETRY; PROCESSING MECHANICS;

FLIP CHIP DEVICES;

EID: 0032652878     PISSN: 00457949     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0045-7949(98)00202-8     Document Type: Article

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