THERMAL BEHAVIOR STUDY OF POWER PLASTIC PACKAGE BY HIGH TEMPERATURE MOIRE INTERFEROMETRY AND FEA MODELING

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1996-AE, Issue , 1996, Pages 141-148

  Zhu, Jiansen ^a   Zou, Daqing ^a   Liu, Sheng ^a   Benson, Jim ^b  

^a Wayne State University   (United States)

^b INTERSIL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GAS TURBINES; INTERFEROMETRY;

BEHAVIOR STUDIES; COOLING PROCESS; FEA MODELING; FEA MODELS; FINITE ELEMENT MODELLING (FEM); HIGHEST TEMPERATURE; MOIRE INTERFEROMETRY; PLASTIC PACKAGES; POWER; THERMAL BEHAVIOURS;

FINITE ELEMENT METHOD;

EID: 85169412672     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1996-0728     Document Type: Conference Paper

References (8)

1. Guo, Y., C.K. Lim, W.T. Chen, and C.G. Woychik, "Solder Ball Connect (SBC) Assemblies under Thermal Loading: I. Deformation Measurement via Moire Interferometry and Its Interpretation," IBM J. of Research and Development, Vol. 37, No. 5, Sept. 1993, pp. 635-647.
2. Guo, Y. and C.K. Lim, "Hybrid Method for Strain/Stress Analysis in Electronic Packaging Using Moire Interferometry and FEM," SEM Spring Conference, Baltimore, Maryland, June 6-8, 1994.
3. Guo, Y., "Experimental Determination of Effective Coefficients of Thermal Expansion in Electronic Packaging," ASME International, Intersociety Electronic Packaging Conference & Exhibition, Lahaina, Hawaii, March 26-30, 1995.
4. Han, B. and Y. Guo, "Thermal Deformation Analysis of Various Electronic Packaging Products by Moire and Microscopic Moire Interferometry," International Mechanical Engineering Congress & Exposition, ASME, Chicago, Illinois, November 6-11, 1994.
5. Han B, Y. Guo, and C.K. Lim, "Application of Interferometric Techniques to Verification of Numerical Model for Microelectronics Packaging Design," ASME International, Intersociety Electronic Packaging Conference & Exhibition, Lahaina, Hawaii, March 26-30, 1995.
6. Post, D., B. Han, and P. Ifju, "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials," Springer-Verlag, NY, 1993.
7. Zhu, J.S., W. Yang, S. Liu, and Y. Guo, "Thermal Deformation and Stress Analysis of a Column Grid Array Package by Hybrid Moire/ FEM Method," 1996a.
8. Zhu, J.S., D.Q. Zou, F.L. Dai, S. Liu, and Y. Guo, "High Temperature Deformation Analysis of High Density Interconnects and Packages by High Density Moire Interferometry," SEM's VIII International Congress on Experimental Mechanics, Experimental/Numerical Mechanics in Electronic Packaging, Nashville, Tennessee, June 10-12, 1996b.