Evaluation of interfacial fracture toughness of a bi-material system under thermal loading conditions

American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

Volumn 6, Issue , 1997, Pages 411-417

  Wang, Jianjun ^a   Zou, Daqing ^a   Liu, Sheng ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0344089703     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Review

References (20)

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