Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 103-110

  Wang, Jianjun ^a   Lu, Minfu ^a   Zou, Daqing ^a   Liu, Sheng ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); INTERFEROMETRY; LASER APPLICATIONS; SEMICONDUCTING SILICON;

CONCENTRATED LOAD; INTERFACIAL FRACTURE TOUGHNESS; LASER MOIRE INTERFEROMETRY;

FLIP CHIP DEVICES;

EID: 0031345306     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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