Effect of thin V insertion layer into Ta film on the performance of Ta diffusion barrier in Cu metallization

Journal of Applied Physics

Volumn 85, Issue 9, 1999, Pages 6898-6903

  Kwak, Joon Seop ^a   Baik, Hong Koo ^a   Kim, Jong Hoon ^b   Lee, Sung Man ^b   Ryu, Hyuk Ju ^c   Je, Jung Ho ^c  

^a Yonsei University   (South Korea)

^b Kangwon National University   (South Korea)

^c Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0011402417     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.370209     Document Type: Article

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