Modeling of the kinetics in copper chemical vapor deposition from Cu(hfac)VTMS

Chemistry of Materials

Volumn 11, Issue 12, 1999, Pages 3470-3475

  Ter Heerdt, M L H ^a   Overdijk, J J ^a   Van Der Put, P J ^a   Schoonman, J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003767182     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm991017n     Document Type: Article

References (33)

1. Murarka, S. P. In Tungsten and Other Advanced Metals for ULSI Applications in 1990; Smith, G. C., Blumenthal, R., Eds.; Materials Research Society: Pittsburgh, PA, 1991; p 179.
2. Gross, M. E.; Donnelly, V. M. In Advanced Metallization for ULSI Applications; Rana, V. V. S., Joshi, R. V., Ohdomari, I., Eds.; Materials Research Society: Pittsburgh, PA, 1992; p 355.
3. Griffin, G. L.; Maverick, A. W. In The Chemistry of Metal CVD; Kodas, T. T., Hampden-Smith, M. J., Eds.; VCH: Weinheim, 1994; p 175.
4. Hampden-Smith, M. J.; Kodas, T. T. In The Chemistry of Metal CVD; Kodas, T. T., Hampden-Smith, M. J., Eds.; VCH: Weinheim, 1994; p 239.
5. Borgharkar, N. S.; Griffin, G. L. J. Electrochem. Soc. 1998, 145, 347.
6. Cheng, T. Q.; Griffiths, K.; Norton, P. R.; Puddephatt, R. J. Appl. Surf. Sci. 1998, 126, 303.
7. Kim, S.; Park, J. M.; Choi, D. J. Thin Solid Films 1998, 320, 95.
8. Lakshmanan, S. K.; Gill, W. N. J. Vac. Sci. Technol., A 1998, 16, 2187.
9. Goswami, J.; Shivashankar, S. A.; Anathakrishna, G. Thin Solid Films 1997, 305, 52.
10. Rauf, I. A.; Gadgil, P. N.; Egerton, R. F.; Boyd, J. D.; Sayer, M. Appl. Phys. Lett. 1997, 71, 2256.
11. Kim, J. Y.; Reucroft, P. J.; Park, D. K. Thin Solid Films 1996, 289, 184.
12. Norman, J. A. T.; Muratore, B. A.; Dyer, P. N.; Roberts, D. A.; Hochberg, A. K. J. Phys. IV 1991, C2, 271.
13. Ter Heerdt, M. L. H.; Van der Put, P. J.; Goossens, A.; Kuijpers, A. D.; Schoonman, J. Mater., Funct. Des., Proc. Eur. Conf. Adv. Mater. Processes Appl., 5th 1997, 3, 41.
14. Ter Heerdt, M. L. H.; Van der Put, P. J.; Goossens, A.; Kuijpers, A. D.; Schoonman, J. Chem. Vap. Deposition, Int. Conf., 14th, EUROCVD-11 1997, 97, 1524.
15. Awaya, N.; Arita, Y. Thin Solid Films 1995, 262, 12.
16. Awaya, N.; Ohno, K.; Arita, Y. J. Electrochem. Soc. 1995, 142, 3173.
17. Jain, A.; Gelatos, A. V.; Kodas, T. T.; Hampden-Smith, M. J.; Marsh, R.; Mogab, C. J. Thin Solid Films 1995, 262, 52.
18. Jain, A.; Chi, K. M.; Kodas, T. T.; Hampden-Smith, M. J. J. Electrochem. Soc. 1993, 140, 1434.
19. Girolami, G. S.; Jeffries, P. M.; Dubois, L. H. J. Am. Chem. Soc. 1993, 115, 1015.
20. Kim, B. M.; Lee, H. H. J. Electrochem. Soc. 1997, 144, 1765.
21. Yoen, H. Y.; Park, Y. B.; Rhee, S. W. J. Mater. Sci.: Mater. Electron. 1997, 8, 189.
22. Nguyen, T.; Charneski, L. J.; Hsu, S. T. J. Electrochem. Soc. 1997, 144, 2829.
23. Lee, W. J.; Rha, S. K.; Lee, S. Y.; Kim, D. W.; Park, C. O. Thin Solid Films 1997, 305, 254.
24. Van der Put, P. J.; Ammerlaan, J. A. M.; Dekker: J. P.; Schoonman, J. Chem. Vap. Deposition 1999, 5, 211.
25. Gates, B. C. Catalytic Chemistry; John Wiley & Sons: New York, 1992.
26. Langmuir, I. J. Am. Chem. Soc. 1918, 40, 1361.
27. Ammerlaan, J. A. M.; Van der Put, P. J.; Schoonman, J. J. Appl. Phys. 1993, 73, 4631.
28. Izquierdo, R.; Bertomeu, J.; Suys, M.; Sacher, E.; Meunier, M. Appl. Surf. Sci. 1995, 86, 509.
29. Farkas, J.; Hampden-Smith, M. J.; Kodas, T. T. J. Electrochem. Soc. 1994, 141, 3539.
30. Popovici, D.; Sacher, E.; Meunier, M.; Léonard, D.; Bertrand, P. In Metallized Plastics 5&6; Fundamental and Applied Aspects; Mittal, K. L., Ed.; VSP: Utrecht, 1998; p 231.
31. Lee, W. J.; Rha, S. K.; Lee, S. Y.; Park, C. O. J. Electrochem. Soc. 1997, 144, 683.
32. Campbell, J. M.; Campbell, C. T. Surf. Sci. 1991, 259, 1.
33. Alexander, C. S.; Pritchard, J. J. Chem. Soc., Faraday Trans. 1 1972, 68, 202.