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Volumn 320, Issue 1, 1998, Pages 95-102

The carrier gas and surface passivation effects on selectivity in chemical vapor deposition of copper films

Author keywords

Carrier gas; Copper; CVD; Passivation; Selectivity

Indexed keywords

ALUMINUM; ARGON; COPPER; HYDROGEN; PASSIVATION; SILICA; SUBSTRATES; THIN FILMS; TITANIUM NITRIDE;

EID: 0032482026     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)01075-4     Document Type: Article
Times cited : (20)

References (24)
  • 11
    • 84919259225 scopus 로고
    • Advanced Metallization for ULSI Application
    • Pittsburgh, PA
    • N. Awaya, Y. Arita, in: Advanced Metallization for ULSI Application, Mater. Res. Soc. Conf. Proc., Pittsburgh, PA, 1991, p. 345.
    • (1991) Mater. Res. Soc. Conf. Proc. , pp. 345
    • Awaya, N.1    Arita, Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.