Field-aided thermal chemical vapor deposition of copper using Cu(I) organometallic precursor

Journal of the Electrochemical Society

Volumn 144, Issue 2, 1997, Pages 683-686

  Lee, Won Jun ^a   Rha, Sa Kyun ^a   Lee, Seung Yun ^a   Park, Chong Ook ^a,b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; ATOMS; COPPER; ELECTRIC FIELD EFFECTS; METALLIC FILMS; MORPHOLOGY; SILICA; SURFACE ROUGHNESS; TITANIUM NITRIDE;

COPPER ATOM; COPPER FILM; DEPOSITION RATE;

METALLORGANIC CHEMICAL VAPOR DEPOSITION;

EID: 0031075363     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837468     Document Type: Article

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