-
3
-
-
0040723030
-
-
S. D. Brotherton, J. P. Cowers, N. D. Young, J. B. Clegg, and J. R. Syres, J. Appl. Phys. 60, 3567 (1986).
-
(1986)
J. Appl. Phys.
, vol.60
, pp. 3567
-
-
Brotherton, S.D.1
Cowers, J.P.2
Young, N.D.3
Clegg, J.B.4
Syres, J.R.5
-
4
-
-
0007465692
-
-
I.-W. Wu, R. T. Fulks, and J. C. Mikkelsen, Jr., J. Appl. Phys. 60, 2422 (1986).
-
(1986)
J. Appl. Phys.
, vol.60
, pp. 2422
-
-
Wu, I.-W.1
Fulks, R.T.2
Mikkelsen J.C., Jr.3
-
6
-
-
0027683858
-
-
S. L. Wu, C. L. Lee, T. F. Lei, and H.-C. Chang, IEEE Trans. Electron Device, ED-40, 1797 (1992).
-
(1992)
IEEE Trans. Electron Device
, vol.ED-40
, pp. 1797
-
-
Wu, S.L.1
Lee, C.L.2
Lei, T.F.3
Chang, H.-C.4
-
7
-
-
0031251115
-
-
C. Salm, D. T. van Veen, D. J. Gravesteijin, J. Holleman, and P. H. Woerlee, J. Electrochem. Soc. 144, 3665 (1997).
-
(1997)
J. Electrochem. Soc.
, vol.144
, pp. 3665
-
-
Salm, C.1
Van Veen, D.T.2
Gravesteijin, D.J.3
Holleman, J.4
Woerlee, P.H.5
-
9
-
-
0026712574
-
-
J.-H. Tseng, M. Orlowski, P. J. Tobin, and R. L. Hance, IEEE Electron Device Lett. 13, 14 (1992).
-
(1992)
IEEE Electron Device Lett.
, vol.13
, pp. 14
-
-
Tseng, J.-H.1
Orlowski, M.2
Tobin, P.J.3
Hance, R.L.4
-
10
-
-
0007960610
-
-
H. R. Liauh, M. C. Chen, J. F. Chen, W. Lur, and C. H. Chua, Nucl. Instrum. Methods Phys. Res. B 74, 134 (1993).
-
(1993)
Nucl. Instrum. Methods Phys. Res. B
, vol.74
, pp. 134
-
-
Liauh, H.R.1
Chen, M.C.2
Chen, J.F.3
Lur, W.4
Chua, C.H.5
-
15
-
-
0033279426
-
-
H. N. Chua, K. L. Pey, S. Y. Siah, E. H. Lim, and C. S. Ho, Mater. Res. Soc. Symp. Proc. 564, 91 (1999).
-
(1999)
Mater. Res. Soc. Symp. Proc.
, vol.564
, pp. 91
-
-
Chua, H.N.1
Pey, K.L.2
Siah, S.Y.3
Lim, E.H.4
Ho, C.S.5
-
16
-
-
85037502423
-
-
C. W. Yap, S. Y. Siah, E. H. Lim, T. K. Lee, and F. H. Gn, presented at the International Interconnect Technology Conference 99 (IITC).
-
International Interconnect Technology Conference 99 (IITC)
-
-
Yap, C.W.1
Siah, S.Y.2
Lim, E.H.3
Lee, T.K.4
Gn, F.H.5
-
17
-
-
85037498280
-
-
K. L. Pey, R. Sundaresan, H. Wong, S. Y. Siah, and C. H. Tung, presented at Low Dimensional Structures and Device (LDSD) 99 Conference.
-
Low Dimensional Structures and Device (LDSD) 99 Conference
-
-
Pey, K.L.1
Sundaresan, R.2
Wong, H.3
Siah, S.Y.4
Tung, C.H.5
-
18
-
-
0033285859
-
-
H. N. Chua, K. L. Pey, S. Y. Siah, L. Y. Ong, E. H. Lim, C. L. Gan, K. H. See, and C. S. Ho, Proceeding 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (1999), p. 44.
-
(1999)
Proceeding 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits
, pp. 44
-
-
Chua, H.N.1
Pey, K.L.2
Siah, S.Y.3
Ong, L.Y.4
Lim, E.H.5
Gan, C.L.6
See, K.H.7
Ho, C.S.8
-
19
-
-
36448999151
-
-
S.-P. Jeng, T.-P. Ma, R. Canteri, M. Anderle, and G. W. Rubloff, Appl. Phys. Lett. 61, 1310 (1992).
-
(1992)
Appl. Phys. Lett.
, vol.61
, pp. 1310
-
-
Jeng, S.-P.1
Ma, T.-P.2
Canteri, R.3
Anderle, M.4
Rubloff, G.W.5
-
20
-
-
0029333576
-
-
C.-K. Hu, K. P. Rodbell, T. D. Sullivan, K. Y. Lee, and D. P. Bouldin, IBM J. Res. Dev. 39, 465 (1995).
-
(1995)
IBM J. Res. Dev.
, vol.39
, pp. 465
-
-
Hu, C.-K.1
Rodbell, K.P.2
Sullivan, T.D.3
Lee, K.Y.4
Bouldin, D.P.5
-
24
-
-
0027844950
-
-
S. Chittipeddi, A. K. Nanda, V. C. Kannan, and W. T. Chochran, Mater. Res. Soc. Symp. Proc. 303, 75 (1993).
-
(1993)
Mater. Res. Soc. Symp. Proc.
, vol.303
, pp. 75
-
-
Chittipeddi, S.1
Nanda, A.K.2
Kannan, V.C.3
Chochran, W.T.4
-
27
-
-
0001457863
-
-
Cs. Szeles, B. Nielsen, P. Asoka-Kumar, and K. G. Lynn, M. Anderle, T. P. Ma, and G. W. Rubloff, J. Appl. Phys. 76, 3403 (1994).
-
(1994)
J. Appl. Phys.
, vol.76
, pp. 3403
-
-
Szeles, Cs.1
Nielsen, B.2
Asoka-Kumar, P.3
Lynn, K.G.4
Anderle, M.5
Ma, T.P.6
Rubloff, G.W.7
-
31
-
-
0003529858
-
-
K. Maex, I. De Wolf, D. Howard, A. Steegen, and A. Lauwers, 4th International Workshop on Stress Induced Phenomena in Metallization (1997), p. 72.
-
(1997)
4th International Workshop on Stress Induced Phenomena in Metallization
, pp. 72
-
-
Maex, K.1
De Wolf, I.2
Howard, D.3
Steegen, A.4
Lauwers, A.5
|