Shock-excited vibrations of a conservative duffing oscillator with application to shock protection in portable electronics

International Journal of Solids and Structures

Volumn 33, Issue 24, 1996, Pages 3627-3642

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; DECELERATION; ELECTRONIC EQUIPMENT; EQUATIONS OF MOTION; LOADS (FORCES); OSCILLATORS (MECHANICAL); PROBABILITY; SHOCK PROBLEMS; SPRINGS (COMPONENTS);

DISPLACEMENT; DUFFING OSCILLATOR; RIGID IMPACT; SHOCK PROTECTION;

VIBRATIONS (MECHANICAL);

EID: 0030269309     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/0020-7683(95)00199-9     Document Type: Article

References (10)

1. Bateman, H. and Erdelyi, A. (1955). Higher Transcendental Functions, McGraw Hill. New York.
2. Engel, P. (1993). Structural Analysis of Printed Circuit Boards, Springer Verlag, New York.
3. Military Handbook. MIL-HDBK-SE (1987).
4. Steinberg, D. S. (1988). Vibration Analysis of Electronic Equipment, 2nd ed., John Wiley, New York.
5. Stoker, J. J. (1950). Nonlinear Vibrations, New York.
6. Suhir, E. and Lee, Y. C. (1990). Thermal, mechanical, and environmental durability design methodologies. In Electronic Materials Handbook, Vol. 1. Packaging, ASM International.
7. Suhir, E. (1992a). Nonlinear dynamic response of a flexible thin plate to constant acceleration applied to its support contour, with application to printed circuit boards used in avionic packaging. Int. J. Solids Structures 29, 41-55.
8. Suhir, E. (1992b). Response of a flexible printed circuit board to periodic shock loads applied to its support contour. ASME J. Appl. Mech. 59, 253-259.
9. Suhir, E. and Burke, R. (1994). Dynamic response of a rectangular plate to a shock load, with application to portable electronic products. IEEE Trans., Components, Packaging, and Manufacturing Technology, Part B 17, 449-460.
10. Suhir, E. (1996). Maximum displacement and maximum acceleration of a one-degree-of-freedom linear system during drop tests : effect of viscous damping. IEEE Trans., Components, Packaging, and Manufacturing Technology, to be published.