Implementation of CMP-based design rules and patterning practices

IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop

Volumn , Issue , 1995, Pages 2-4

  Camiletti, L E ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; DIELECTRIC FILMS; DIES; PHOTOLITHOGRAPHY; SEMICONDUCTOR DEVICE MODELS; STATISTICAL METHODS; THICKNESS CONTROL;

CHEMICAL MECHANICAL POLISHING; CRITICAL DIMENSION VARIANCE; DIE PATTERNING; PHOTOLITHOGRAPHIC EXPOSURE WAVELENGTH;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0029516547     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)