A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AG, Issue , 2000, Pages 91-101

  Lau, John H ^a   Pan, Stephen H ^a   Chang, Chris ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELASTOPLASTICITY; FINITE ELEMENT METHOD; FRACTURE MECHANICS; PRINTED CIRCUIT BOARDS; STRAIN ENERGY;

AVERAGE STRAIN; CRACK LENGTH; EMPIRICAL EQUATIONS; FATIGUE LIFE PREDICTION MODELS; SOLDER JOINTS; STRAIN ENERGY DENSITY; THERMAL FATIGUE-LIFE; THERMAL-FATIGUE LIFE; TIME DEPENDENT; WAFER-LEVEL CHIP SCALE PACKAGES;

CRACK TIPS;

EID: 85120431836     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-2259     Document Type: Conference Paper

References (16)

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