Fabrication of wafer level chip scale packaging for optoelectronic devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1145-1147

  Jim, K L ^a   Faulkner, G E ^a   O'Brien, D C ^a   Edwards, D J ^a   Lau, J H ^a  

^a UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD ALLOYS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); LIGHT EMITTING DIODES; METALLIZING; MULTICHIP MODULES; OPTOELECTRONIC DEVICES; OXIDES; PALLADIUM ALLOYS; SOLDERING;

CONDUCTING OXIDE; ELECTROPLATED SOLDER DEPOSITION; EUTECTIC SOLDERBUMP; LIGHT EMITTING DIODE CHIP; REWIRING METALLIZATION; WAFER LEVEL CHIP SCALE PACKAGING;

ELECTRONICS PACKAGING;

EID: 0032657116     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)