Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1360-1368

  Lau, J ^a   Chang, C ^a   Lee, S W R ^b  

^a Express Packaging Systems Inc   (United States)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FATIGUE OF MATERIALS; FRACTURE MECHANICS; PRINTED CIRCUIT BOARDS; RELIABILITY; SILICON WAFERS; SOLDERED JOINTS; STRESS INTENSITY FACTORS; THERMAL CYCLING;

THERMAL FATIGUE; WAFER LEVEL CHIP SCALE PACKAGE;

ELECTRONICS PACKAGING;

EID: 0034476691     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)