High Power UV Laser Machining of Silicon Wafers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5063, Issue , 2003, Pages 495-500

  Corboline, Tom ^a   Rea Jr , Edward C ^a   Dunsky, Corey ^a  

^a Research and Development Department   (United States)

Author keywords

Diode pumped solid state lasers; Laser cutting; Silicon; UV

Indexed keywords

CRACK INITIATION; DIODES; MACHINING; PUMPING (LASER); RELIABILITY; SOLID STATE LASERS;

DIODE-PUMPED SOLID-STATE LASERS; LASER-CUTTING; MULTI-PASS CUTTING STRATEGY;

SILICON WAFERS;

EID: 2342451939     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.540931     Document Type: Conference Paper

References (3)

1. T. Harder & W. Reinert: "Low profile and Flexible Electronics Assemblies using ultra-thin Silicon - The European FLEX-SI Project" ICAPS 2002, Reno, Nevada, March 2002
2. P.K. Subrahmanyan: "Laser Micromachining in Microelectronics Manufacturing", OnBoard Technology, April 2003
3. 2 Lasers" ICALEO 2002, Scottsdale, AZ, October 2002