Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4830, Issue , 2002, Pages 526-530

  Kawahara, Kosuke ^b   Kurogi, Yasunobu ^a   Matsuo, Naoyuki ^a   Ninomiya, Takafumi ^b   Sawada, Hiroshi ^b   Yokotani, Atsushi ^a   Kurosawa, Kou ^a  

^a UNIVERSITY OF MIYAZAKI   (Japan)

^b NEC CORPORATION   (Japan)

Author keywords

Double pulse; Femtosecond laser; Laser ablation; Laser scanning microscope; Pulse energy ratio; Pulse separation time

Indexed keywords

MICROMACHINING; SEMICONDUCTING SILICON; SEMICONDUCTOR MATERIALS; THIN FILMS;

LASER SCANNING MICROSCOPY;

LASER ABLATION;

EID: 0037621723     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.486542     Document Type: Conference Paper

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