Hermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 222-227

  Jourdain, A ^a   De Coster, J ^b   De Moor, P ^a   Puers, R ^b   Tilmans, H A C ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

0 level packaging; Hermeticity; Leak rate; MEMS resonator; Q factor

Indexed keywords

ELECTRIC SWITCHES; LEAD ALLOYS; LEAK DETECTION; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; Q FACTOR MEASUREMENT; RESONATORS; TESTING; TIN ALLOYS;

AMBIENT PRESSURES; DAMPING CHARACTERISTICS; EXPERIMENTAL INVESTIGATIONS; HERMETICITY; LEAK RATE; MEMS RESONATORS; Q-FACTORS; SEALED CAVITIES;

PACKAGING;

EID: 85082174150     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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