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Volumn , Issue , 2005, Pages 599-603

A method to evaluate internal cavity pressure of sealed MEMS devices

Author keywords

MEMS resonator; Wafer level packaging

Indexed keywords

MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; QUALITY CONTROL; RESONATORS;

EID: 70349953990     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (8)
  • 2
    • 0032049404 scopus 로고    scopus 로고
    • Low-pressure-encapsulated resonant structures with integrated electrodes for electrostatic excitation and capacitive detection
    • T. Corman, P. Enoksson, and G. Stemme, Low-pressure-encapsulated Resonant Structures with Integrated Electrodes for electrostatic excitation and capacitive detection, Sensors and Actuators A 66 (1998) pp. 160-166.
    • (1998) Sensors and Actuators A , vol.66 , pp. 160-166
    • Corman, T.1    Enoksson, P.2    Stemme, G.3
  • 3
    • 3042624549 scopus 로고    scopus 로고
    • MRS fall meeting 1-5 Dec Boston, Mat. Res. Soc. Symp. Proc.
    • J.T.M. van Beek et al, High-Q Integrated Passives and RF-MEMS on silicon, MRS fall meeting 1-5 Dec, 2003, Boston, Mat. Res. Soc. Symp. Proc. Vol. 783, pp. B3.1.1-B3.1.12.
    • (2003) High-Q Integrated Passives and RF-MEMS on Silicon , vol.783 , pp. B311-B3112
    • Van Beek, J.T.M.1
  • 4
    • 85082174150 scopus 로고    scopus 로고
    • Hermeticity investigation of sealed 0-level packages based on the damping characteristics of the MEMS device
    • June 12-15, Brugge, Belgium
    • A. Jourdain, J. De Coster, P. De Moor, R. Puers and H. A. C. Tilmans, Hermeticity Investigation of Sealed 0-level Packages Based on the Damping Characteristics of the MEMS Device, Proc. EMPC 2005, June 12-15, Brugge, Belgium.
    • (2005) Proc. EMPC
    • Jourdain, A.1    De Coster, J.2    De Moor, P.3    Puers, R.4    Tilmans, H.A.C.5
  • 5
    • 0030091526 scopus 로고    scopus 로고
    • Equivalent circuit representation of electromechanical transducers: I. Lumped-parameter systems
    • H. A. C. Tilmans, Equivalent Circuit Representation of Electromechanical Transducers: I. Lumped-parameter Systems, J. Micromech. Microeng. 6 (1996) pp. 157-176.
    • (1996) J. Micromech. Microeng , vol.6 , pp. 157-176
    • Tilmans, H.A.C.1
  • 6
    • 0033312834 scopus 로고    scopus 로고
    • Electromechanical modelling of electrostatically driven microresonators, Part I: Basic theory
    • H. A. C. Tilmans, Electromechanical modelling of electrostatically driven microresonators, Part I: Basic theory, Int. J. Mod. & Sim. 19 (1999) pp. 364-373.
    • (1999) Int. J. Mod. & Sim. , vol.19 , pp. 364-373
    • Tilmans, H.A.C.1
  • 7
    • 0242468690 scopus 로고    scopus 로고
    • Modified reynolds equation and analytical analysis of squeeze-film air damping of perforated structures
    • M. Bao, H. Yang, Y. Sun and P. J. French, Modified Reynolds Equation and analytical Analysis of Squeeze-film Air Damping of Perforated Structures, J. Micromech. Microeng. 13 (2003) pp. 795-800.
    • (2003) J. Micromech. Microeng , vol.13 , pp. 795-800
    • Bao, M.1    Yang, H.2    Sun, Y.3    French, P.J.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.