Lateral conduction within CNT-based planar microcoils on silicon substrate

2017 IEEE 12th Nanotechnology Materials and Devices Conference, NMDC 2017

Volumn 2018-January, Issue , 2017, Pages 83-84

  Ali, Zishan ^a   Ghosh, Kaushik ^b   Poenar, D P ^a   Aditya, Sheel ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c INSTITUTE OF NANO SCIENCE AND TECHNOLOGY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON;

ANISOTROPIC BEHAVIORS; CURRENT CONDUCTION; ELECTRICAL CHARACTERIZATION; ELECTRICAL CONDUCTIVITY; HIGH ASPECT RATIO TRENCHES; LATERAL CURRENTS; MICROCOIL; ON CHIPS; PLANAR MICROCOIL; SILICON SUBSTRATES;

ASPECT RATIO;

EID: 85047978257     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NMDC.2017.8350512     Document Type: Conference Paper

References (18)

1. P.-H. Haumesser et al., "Copper metallization for advanced interconnects: The electrochemical revolution, " Interconnect Technology Conference, Proceedings of the IEEE 2004 International. 2004.
2. J. N. Burghartz et al., "Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and lowloss substrates", IEEE Trans. Microwave Theory and Techniques, 1997. 45(10), p. 1961-1968.
3. H. Lakdawala et al., "Micromachined high-Q inductors in a 0. 18-m copper interconnect low-k dielectric CMOS process", IEEE J. Solid-State Circ., 2002, 37(3): p. 394-403.
4. C. H. Ahn and M. G. Allen, "Micromachined planar inductors on silicon wafers for MEMS applications", IEEE Trans. Ind. Electron., 1998, 45(6): p. 866-876.
5. S.-G. Kim et al., "Microfabrication and characteristics of doublerectangular spiral type thin-film inductors with an upper NiFe magnetic core", J. Appl. Phys., 2001. 90(7), p. 3533-3538.
6. M. Tang et al., "High-Q on-chip inductors using extremely thick silicon dioxide and copper-damascene technology", Electron. Lett., 2008, 44(3), p. 241-242.
7. Q. Zhu et al., "Micro-fabrication of Flexible Coils with Copper Filled Through Polymer Via Structures", in J. Phys. : Conference Series, 2013, IOP Publishing.
8. Purohit et al., "Carbon Nanotubes and Their Growth Methods, " Procedia Materials Science, 2014, 6, p. 716-728
9. R. Xie et al, "Carbon nanotube growth for through silicon via application", J. Nanotechnol., 2013, 24(23), 125603 (7 pages).
10. T. Bhuvana et al., "Contiguous Petal-like Carbon Nanosheet Outgrowths from Graphite Fibers by Plasma CVD", ACS Appl. Mat. & Interf., 2011, 2(3), p. 644-648.
11. X. Zhao et al., "Oxidation characteristics and magnetic properties of iron carbide and iron ultrafine particles", J. Appl. Phys., 1996, 80(10), p. 5857-5860.
12. E. Sajitha et al., "Size-dependent magnetic properties of iron carbide nanoparticles embedded in a carbon matrix", J. Phys. : Condensed Matter, 2007, 19(4), p. 046214.
13. N. Fan et al., "Formation, characterization and magnetic properties of carbon-encapsulated iron carbide nanoparticles", Mat. Res. Bull., 2008, 43(6), p. 1549-1554.
14. C. Fang et al., "Structural, electronic, and magnetic properties of iron carbide Fe7 C3 phases from first-principles theory", Phys. Rev. B, 2009, 80(22), p. 224108.
15. C. C. Yap et al., "Carbon nanotube bumps for the flip chip packaging system", Nanoscale Res. Lett., 2012, 7(1), p. 105
16. Lu Congxiang et al., "Solid source growth of Si oxide nanowires promoted by carbon nanotubes", Appl. Surf. Sci., 2014, 314, p. 119-123.
17. M. Zdrojek et al., "Studies of multiwall carbon nanotubes using Raman spectroscopy and atomic force microscopy", Solid State Phenomena, 2004, 99-100, p. 265-268.
18. A. C. Ferrari, "Raman spectroscopy of graphene and graphite: Disorder, electron-phonon coupling, doping and non-adiabatic effects", Solid State Comm., 2007, 143(1-2), p. 47-57.