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Volumn , Issue , 2004, Pages 3-5
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Copper metallization for advanced interconnects: The electrochemical revolution
a
CEA GRENOBLE
(France)
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL VAPOR DEPOSITION;
ELECTROCHEMISTRY;
ELECTRODEPOSITION;
ELECTROLYTES;
ELECTROPLATING;
ELECTROPLATING SOLUTIONS;
METALLIZING;
OPTICAL INTERCONNECTS;
ATOMIC LAYER DEPOSITION (ALD);
BARRIER DEPOSITION TECHNIQUE;
BARRIER PLATING;
COPPER SEEDING;
ELECTRO-GRAFTING;
COPPER PLATING;
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EID: 8644265220
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (8)
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References (7)
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