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Volumn , Issue , 2004, Pages 3-5

Copper metallization for advanced interconnects: The electrochemical revolution

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTROCHEMISTRY; ELECTRODEPOSITION; ELECTROLYTES; ELECTROPLATING; ELECTROPLATING SOLUTIONS; METALLIZING; OPTICAL INTERCONNECTS;

EID: 8644265220     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (7)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.