Electrical modeling of copper/carbon nanotubes for 3D integration

16th International Conference on Nanotechnology - IEEE NANO 2016

Volumn , Issue , 2016, Pages 763-766

  Rao, Madhav ^a  

^a INTERNATIONAL INSTITUTE OF INFORMATION TECHNOLOGY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; CARBON NANOTUBES; COPPER; ELECTRIC VARIABLES MEASUREMENT; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS; NANOTECHNOLOGY; NANOTUBES; REACTIVE ION ETCHING; YARN;

3-D INTERCONNECTS; 3D INTERCONNECT; DEEP REACTIVE ION ETCHING; DIFFERENT LAYERS; ELECTRICAL BEHAVIORS; ELECTRICAL MODELING; HIGH-FREQUENCY APPLICATIONS; THROUGH SILICON VIAS;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 85006856455     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2016.7751327     Document Type: Conference Paper

References (11)

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