Interface dynamics in one-dimensional nanoscale Cu/Sn couples

Acta Materialia

Volumn 125, Issue , 2017, Pages 136-144

  Yin, Qiyue ^a   Gao, Fan ^b   Gu, Zhiyong ^b   Wang, Jirui ^b   Stach, Eric A ^c   Zhou, Guangwen ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b University of Massachusetts   (United States)

^c BROOKHAVEN NATIONAL LABORATORY   (United States)

Author keywords

Cu Sn; Cu3Sn; Cu6Sn5; Diffusion; Interface; Transmission electron microscopy

Indexed keywords

BINARY ALLOYS; DIFFUSION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; IN SITU PROCESSING; INTERFACES (MATERIALS); SANDWICH STRUCTURES; TRANSMISSION ELECTRON MICROSCOPY;

CU3SN; CU6SN5; IN-SITU TRANSMISSION ELECTRON MICROSCOPIES; INTERFACE DYNAMIC; INTERFACE ENERGY; INTERFACE EVOLUTION; INTERMETALLIC COMPOUND GROWTHS; METALLURGICAL REACTION;

COPPER;

EID: 85002194653     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2016.11.051     Document Type: Article

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