SCOPUS 정보 검색 플랫폼

Volumn 7, Issue 16, 2015, Pages 7368-7377

Robust Ag nanoplate ink for flexible electronics packaging

(9) Li, Ruo Zhou a,b Hu, Anming b Bridges, Denzel b Zhang, Tong a Oakes, Ken D c Peng, Rui d Tumuluri, Uma d Wu, Zili d Feng, Zhili d

a SOUTHEAST UNIVERSITY (China)

b University of Tennessee (United States)

c CAPE BRETON UNIVERSITY (Canada)

d OAK RIDGE NATIONAL LABORATORY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRONICS PACKAGING; FLEXIBLE ELECTRONICS; INFRARED DEVICES; LOW TEMPERATURE OPERATIONS; MICROCRACKS; NANOSTRUCTURES; SILVER; TEMPERATURE;

ANISOTROPIC RESISTIVITY; ELECTRICAL CONDUCTIVITY; ELECTRONIC PACKAGING; LOW-TEMPERATURE BONDING PROCESS; POLYVINYL PYRROLIDONE; PRINTABLE ELECTRONICS; SENSING APPLICATIONS; TRANSFORMATION TEMPERATURES;

SINTERING;

EID: 84927949268 PISSN: 20403364 EISSN: 20403372 Source Type: Journal
DOI: 10.1039/c5nr00312a Document Type: Article

Times cited : (81)

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