Investigation of nonlinear behaviors of packaging materials and its application to a flip-chip package

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 31-40

  Ren, W ^a   Wang, J ^a   Qian, Z ^a   Zou, D ^a   Liu, S ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; CHIP SCALE PACKAGES; CREEP; ELASTOPLASTICITY; ELECTRONICS PACKAGING; FATIGUE DAMAGE; FATIGUE OF MATERIALS; FATIGUE TESTING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); INTERFEROMETRY; LEAD ALLOYS; LEAD COMPOUNDS; MOIRE FRINGES; PACKAGING; PACKAGING MATERIALS; SOLDERING; STRAIN RATE; TIN ALLOYS; TIN COMPOUNDS;

EQUIVALENT STRAINS; FATIGUE LIFE PREDICTION; FLIP-CHIP PACKAGES; MATERIAL DATABASE; MOIRE INTERFEROMETRY; NONLINEAR BEHAVIOR; NONLINEAR MATERIAL BEHAVIOR; STRAIN-RATE-DEPENDENT;

FLIP CHIP DEVICES;

EID: 84988742289     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757283     Document Type: Conference Paper

References (15)

1. J. Auersperg, "Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip Assemblies by FEA and Microdac, " ASME, Symposium on Applications of Fracture Mechanics in Electronic Packaging, Dallas, November 16-21, pp. 133-138, 1997.
2. K. Darbha, J.H. Okura and A. Dasgupta, "Impact of Underfill Filler Particles on Reliability Of Flip Chip Interconnects, " 1 st IEEE International Symposium on Polymeric Electronics Packaging, PEP'97 Norrkoping, Sweden, 1997.
3. J. D. Feny, "Viscoelastic Properties of Polymers, " 3rd Edition, John Wiley & Sons, 1980.
4. V. Gektin, A. Bar-Cohen, and J. Ames, "Coffin- Manson Fatigue Model of Underfilled Flip-Chips, " IEEE Trans. CPMT Part A. Vol. 20, no. 3, Sept. pp.317-326, 1997.
5. Bor Zen Hong, Tsomg-Dih Yuan and Lloy G. Burrell, "Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling, " in Sensing, Modeling and Simulation in Emerging Electronic Packaging, ASME, EEP Vol. 17, 1996, pp. 39-46.
6. J. H. Lau, "Flip Chip Technologies, " McGraw-Hill, New York, 1996.
7. J. H. Lau and Yi-Hsin Pao, "Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, " McGraw-Hill, New York, 1997
8. John H.L. Pang, Tze-Ing Tan and Suresh K. Sitaraman, " Thermo-Mechanical Analysis of Solder Joint Fatigue and Creep in a Flip Chip on Board Package Subjected to Temperature Cycling Loading, " 48" Electronic Components and Technology Conference, Seattle, Washington, pp. 878-883, 1998.
9. D. Post, B. Han, and P. Ifju, "High Sensitivity Moirk: Experimental Analysis for Mechanics and Materials, " Springer-Verlag, NY, 1993.
10. Z. Qian, J. Yang and S. Liu, "Visco-Elastic- Plastic Properties and Constitutive Modeling of Underfills, " 48th ECTC, Seattle, May 25-28, 1998.
11. W. Ren, Z. Qian, M. Lu, S . Liu and D. Shangguan, "Thermal Mechanical Properties of Two Solder Alloys, " in Applications of Experimental Mechanics to Electronic Packaging, ASME, EEP. Vol. 22, AMD-Vol. 226, pp. 125-130, 1997.
12. Wei Ren, Zhengfang Qian and Sheng Liu, "Thermo-Mechanical Creep of Two Solder Alloys, " 48th Electronic Components and Technology Conference, Seattle, Washington, 1998 pp. 1431-1437.
13. J. Wang, Z. Qian, D. Zou and S. Liu, "Creep Behavior of a flip-chip package by both FEM Modeling and Real Time Moire Interferometry, " Transactions of the ASME, Journal of Electronic Packaging, Vol. 120, N0.2, 1998, pp. 179-185.
14. Jie-Hua Zhao, Xiang Dai and Paul S. Ho, "Analysis and Modeling Verification for Thermal- mechanical Deformation in Flip-chip Packages, " 48th Electronic Components and Technology Conference, Seattle, Washington, pp. 336-344, 1998.
15. D. Zou, J. Wang, J. Zhu, M. Lu and S. Liu, "Creep Behavior Study of Plastic Power Package By Real Time Moire Interferometry and FEM Modeling, " ASME, Symposium on Applications of Experimental Mechanics to Electronic Packaging Dallas, November 16-21, 1997, pp. 51-57.