Thermo-mechanical creep of two solder alloys

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1431-1437

  Ren, Wei ^a   Qian, Zhengfang ^a   Liu, Sheng ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; BISMUTH ALLOYS; CREEP; ELECTRONICS PACKAGING; EUTECTICS; FATIGUE TESTING; INDIUM ALLOYS; NETWORK COMPONENTS; SILVER ALLOYS; TIN ALLOYS; MATHEMATICAL MODELS; VISCOPLASTICITY;

CREEP CHARACTERISTICS; CREEP PROPERTIES; CREEP RUPTURE TIME; EUTECTIC SOLDERS; LEAD-FREE SOLDER ALLOY; MODEL PREDICTION; THERMO-MECHANICAL; VISCOPLASTIC CONSTITUTIVE MODELING;

LEAD-FREE SOLDERS; SOLDERING ALLOYS;

CREEP RUPTURE TIME;

EID: 0031624410     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678932     Document Type: Conference Paper

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