Thermal mechanical properties of two solder alloys

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 226, Issue , 1997, Pages 125-129

  Ren, Wei ^a   Qian, Zhengfang ^a   Lu, Minfu ^a   Liu, Sheng ^a   Shangguan, Dongkai ^b  

^a Wayne State University   (United States)

^b FORD MOTOR COMPANY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3743062813     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (18)

1. P. J. Adams, "Thermal Fatigue of Solder Joints in Micro-electronic Devices," M.S. thesis, Dept. of Mech. Eng., MIT, Cambridge, MA, 1981.
2. CINDAS, SRC Document, Purdue University, 1997.
3. R. Darveaux and K Banerji, "Constitutive Relations for Tin-Based Solder Joints," IEEE Trans, on Components, Hybrids, and Manufacturing Tech., Vol. 15, No. 6, pp.1013-1024, 1992.
4. G. J Ewell, S. R. Robertson, "Development of Pb-free Solder: An Overview ", The Second Int. Symp. on Elec. Packag. Tech., Shanghai, pp73∼78, China, 1996;
5. D. R. Frear, W. B. Jones and K. R. Kinsman, Solder Mechanics, A State of the Art Assessment, TMS, New Mexico, 1990.
6. D. R. Frear, "Thermo-mechanical Fatigue of Solder Joints: A New Comprehensive Test Method," IEEE Trans. on Components, Hybrids, and Manufacturing Tech., Vol. 12, pp.492∼501, 1989.
7. J. Glazer, "Microstructure and Mechanical Properties of Pb-Free Solder Alloys for low-cost Electronic Assembly: A Review," J. Elec. Mat. Vol. 23, pp. 693-700,1994;
8. S. K. Kang, "Lead(Pb)-free Solders for Electronic Packaging ", J. Elec. Mat., Vol. 23, pp. 701∼707, 1994;
9. J. H. Lau, "Solder Joint Reliability," Van Nostrand Reinhold, New York, 1991.
10. M. Lu, W. Ren and S. Liu, "A Unique Multi-Axial Thermo-Mechanical Fatigue Tester For Electronic Packaging Materials", The Second International Symposium on Electronic Packaging Technology, Shanghai, Dec.9-12, China, 1996
11. M. Lu and S. Liu, "A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials" in Sensing, Modeling and Simulation in Emerging Electronic Packaging, ASME 1996, EEEP, V17, 87-92.
12. W. Ren, M. Lu, S. Liu and D. Shangguan, "Thermal Mechanical Property Testing of New Lead Free Solder Joints," Accepted by J. Solder & Surface Mount Tech., 1997.
13. D. Shangguan, A. Achari, and W. Green, "Application of Lead Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules ", IEEE Trans. on Components, Packaging, and Manufacturing Tech. - Part B, Vol. 17, pp.603∼611, 1994;
14. D. Shangguan and G. Gao, "Environmentally Conscious Manufacturing Technologies for Automotive Electronics", Proc. Second Inter. Symp. on Electronic Packg. Tech., Shanghai, China, pp.391∼402, 1996;
15. D. Shangguan and A. Achari, "Evaluation of Lead Free Eutectic Sn-Ag Solder for Automotive Electronics Manufacturing Packaging Applications", Proceedings of the International Electronic Manufacturing Technology Symposium, La Jolla, CA, pp.25∼37, September 1994;
16. D. Shangguan and A. Achari, United States Patent, Patent Number: 5,429,689, Jul. 4, 1995.
17. D. J. Xie, Yan C. Chan, J. K. L. Lai and I. K. Hui, "Fatigue Life Estimation of Surface Mount Solder Joints," IEEE Trans. on Components, Packaging, and Manufacturing Tech.- Part B, Vol. 19, No.3, pp.669∼677, 1996;
18. Z. Zhang, Daping Yao, J. K. Shang, "Fatigue Crack Initiation in Solder Joints," J. of Elec. Pack., Vol. 118, pp.41-44, 1996.