Creep behavior study of plastic power package by real time moiré interferometry and fem modeling

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 226, Issue , 1997, Pages 51-55

  Zou, Daqing ^a   Wang, Jianjun ^a   Lu, Minfu ^a   Liu, Sheng ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3743092817     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)

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