Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 1822-1826

  Kim, Kyoung Ho ^a   Yoo, Sehoon ^a   Yoon, Jonghyuk ^b   Yim, Songhee ^b   Baek, Bum Gyu ^b   Yoon, Jong Hyun ^b   Jung, Dohyun ^c   Jung, Jae Pil ^c  

^a Korea Institute of Industrial Technology   (South Korea)

^b R and D Center   (South Korea)

^c University of Seoul   (South Korea)

Author keywords

La2O3; Nano composite; Printing; Reliabiltiy; Sn Ag Cu; Solder; Toughness

Indexed keywords

CREEP RESISTANCE; LEAD-FREE SOLDERS; NANOCOMPOSITES; NANOPARTICLES; NETWORK COMPONENTS; PRINTING; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; TOUGHNESS;

HIGH MECHANICAL STRENGTH; JOINT PROPERTY; LA2O3; NANOCOMPOSITE SOLDER; RELIABILTIY; SN-AG-CU; THERMAL SHOCK RESISTANCE; THERMOMECHANICAL RELIABILITY;

TIN;

EID: 84987834859     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.250     Document Type: Conference Paper

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