Fabrication and interfacial reaction of carbon nanotube-embedded Sn-3.5Ag solder balls for ball grid arrays

Journal of Alloys and Compounds

Volumn 583, Issue , 2014, Pages 155-161

  Ko, Young Ki ^a   Kwon, Sang Hyun ^a   Lee, Young Kyu ^a   Kim, Jun Ki ^a   Lee, Chang Woo ^a   Yoo, Sehoon ^a  

^a Korea Institute of Industrial Technology   (South Korea)

Author keywords

Carbon nanotube; Composite; Embedding; Intermetallic compound; Sn 3.5Ag; Thermal aging

Indexed keywords

BALL MILLING PROCESS; EMBEDDING; IMC THICKNESS; IMPACT ENERGY; SIZE AND SHAPE; SN-3.5AG; SN-3.5AG SOLDERS; SOLDER BALLS;

BALL MILLING; CARBON NANOTUBES; COMPOSITE MATERIALS; INTERMETALLICS; SILVER; SOLDERING ALLOYS; THERMAL AGING;

TIN;

EID: 84884333669     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.08.052     Document Type: Article

References (35)

1. T.C. Chiu, K. Zeng, R. Stierman, D. Edwards, K. Ano, in: 54th Electronic Components and Technology Conference. Piscataway, NJ, 2004, p. 1256.
2. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, K.N. Tu, in: 54th Electronic Components and Technology Conference. Piscataway, NJ, 2004, p. 668.
3. K.S. Kim, S.H. Huh, and K. Suganuma Microelectron. Reliab. 43 2002 259
4. S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.-I. Cho, J. Yu, and W.K. Choi JOM 56 2004 33
5. W. Liu, P. Bachorik, N.C. Lee, in: Proceedings of Surface Mount Technology Association, 2008, p. 625.
6. L.W. Lin, J.M. Song, Y.S. Lai, Y.T. Chiu, N.C. Lee, and J.Y. Uan Microelectron. Reliab. 49 2009 235
7. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang Mater. Sci. Eng. R 44 2004 1
8. A.M. Yu, J.-K. Kim, J.-H. Lee, and M.-S. Kim Mater. Res. Bull. 45 2010 359
9. J. Zhao, Y. Mutoh, Y. Miyashita, and S. Mannan J. Electron. Mater. 31 2002 879
10. M.G. Cho, S.K. Kang, D.-Y. Shih, and H.M. Lee J. Electron. Mater. 36 2007 1501
11. J. Shen, and Y.C. Chan Microelectron. Reliab. 49 2009 223
12. Y.-S. Shin, S. Lee, S. Yoo, C.-W. Lee, in: 17th European Microelectronics and Packaging Conference, Rimini, Italy, 2009, p. 14.
13. Y. Shi, J. Liu, Z. Xia, Y. Lei, F. Guo, and X. Li J. Mater. Sci.: Mater Electron. 21 2010 256
14. D. Lin, G.X. Wang, T.S. Srivatsan, M. Al-Hajri, and M. Petraroli Mater. Lett. 53 2002 333
15. Y. Shi, J. Liu, Y. Yan, Z. Xia, Y. Lei, F. Guo, and X. Li J. Electron. Mater. 37 2008 507
16. S. Jin, and M. McCoramack J. Electron. Mater. 23 1994 735
17. X.L. Zhong, and M. Gupta J. Phys. D 41 2008 095403
18. D.C. Lin, S. Liu, T.M. Guo, G.X. Wang, T.S. Srivatsan, and M. Petraroli Mater. Sci. Eng. A 360 2003 285
19. X. Wang, Y.C. Liu, C. Wei, H.X. Gao, P. Jiang, and L.M. Yu J. Alloys Comp. 480 2009 662
20. K.M. Kumar, V. Kripesh, L. Shen, and A.A.O. Tay Thin Solid Films 504 2006 371
21. M.-F. Yu, O. Lourie, M.J. Dyer, K. Moloni, T.F. Kelly, and R.S. Ruoff Science 287 2000 637
22. S. Hong, and S. Myung Nat. Nanotechnol. 2 2007 207
23. S. Belluci Phys. Stat. Sol. 2 2005 34
24. H. Yu, C. Lu, T. Xi, L. Luo, J. Ning, and C. Xiang J. Therm. Anal. Calorimetry 82 2005 97
25. M.R.C. Hunt, M. Montalti, Y. Chao, S. Krishnamurthy, V.R. Dhanak, and L. Siller Appl. Phys. Lett. 81 2002 4847
26. K.M. Kumar, V. Kiropesh, and A.A.O. Toy J. Alloys Comp. 455 2008 148
27. K.M. Kumar, V. Kiropesh, and A.A.O. Toy J. Alloys Comp. 450 2008 229
28. S.M.L. Nai, J. Wei, and M. Gupta Mater. Sci. Eng. A 423 2006 166
29. S.M.L. Nai, J. Wei, and M. Gupta Thin solid films 504 2006 401
30. E.K. Choi, K.Y. Lee, and T.S. Oh J. Phys. Chem. Solid 69 2008 1403
31. K.-J. Lee, M.-H. Hsu, H.-Z. Cheng, J.S.-C. Jang, S.-W. Lin, C.-C. Lee, and S.-C. Lin J. Alloys Comp. 483 2009 389
32. J.P. Piret, S. Detriche, R. Vigneron, S. Vankoningsloo, S. Rolin, J. Mejia Mendoza, B. Masereel, S. Lucas, J. Delhalle, F. Luizi, C. Saout, and O. Toussaint J. Nanoparticle Res. 12 2010 75
33. M.O. Alam, Y.C. Chan, and K.N. Tu Chem. Mater. 15 2003 4340
34. S.M.L. Nai, J. Wei, and M. Gupta J. Alloys Comp. 473 2009 100
35. M. Amagai Microelectron. Reliab. 48 2008 1