SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 3, 2010, Pages 256-261

Study on creep characterization of nano-sized Ag particle-reinforced Sn-Pb composte solder joints

(6) Shi, Yaowu a Liu, Jianping a Xia, Zhidong a Lei, Yongping a Guo, Fu a Li, Xiaoyan a

a BEIJING UNIVERSITY OF TECHNOLOGY (China)

Author keywords

[No Author keywords available]

Indexed keywords

AG PARTICLES; COMPOSITE SOLDERS; CREEP STRAIN; LINEAR CURVE; LOAD CREEP TESTS; NANO-SIZED; SINGLE SPECIMEN; SN-37PB; SOLDER JOINTS; STEADY-STATE CREEP;

ACTIVATION ENERGY; CREEP; CREEP RESISTANCE; CURVE FITTING; LEAD; PARTICLE REINFORCED COMPOSITES; TIN;

SILVER;

EID: 77949264300 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-009-9902-7 Document Type: Article

Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.