All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 343-349

  Zurcher, Jonas ^a   Carro, Luca Del ^a   Schlottig, Gerd ^a   Wright, Daniel Nilsen ^b   Vardoy, Astrid Sofie B ^b   Taklo, Maaike M Visser ^b   Mills, Tobias ^c   Zschenderlein, Uwe ^d   Wunderle, Bernhard ^d   Brunschwiler, Thomas ^d  

^a IBM RESEARCH ZURICH   (Switzerland)

^b SINTEF   (Norway)

^c INTRINSIQ MATERIALS LTD   (United Kingdom)

^d CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Advanced packaging; Electromigration; Flip chip; Interconnect processes; Non solder interconnections; Novel packaging methodologies

Indexed keywords

CHIP SCALE PACKAGES; COPPER; ELECTROMIGRATION; FLIP CHIP DEVICES; NANOPARTICLES; NETWORK COMPONENTS; SINTERING; TEMPERATURE; TENSILE STRENGTH;

ADVANCED PACKAGING; ELECTRICAL AND MECHANICAL PROPERTIES; FLIP CHIP; FLIP CHIP INTERCONNECTS; NANOPARTICLE SINTERING; NOVEL PACKAGING METHODOLOGIES; PRESSURE-LESS SINTERING; SOLDER INTERCONNECTIONS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84987819076     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.42     Document Type: Conference Paper

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