Enhanced electrical and thermal interconnects by the self-assembly of nanoparticle necks utilizing capillary bridging

Journal of Electronic Packaging

Volumn 136, Issue 4, 2014, Pages

  Brunschwiler, Thomas ^a   Schlottig, Gerd ^a   Ni, Songbo ^a   Liu, Yu ^a   Goicochea, Javier V ^a   Zürcher, Jonas ^a   Wolf, Heiko ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM OXIDE; ANNEALING; COPPER; EVAPORATION; NANOPARTICLES; SELF ASSEMBLY; SILVER; SUSPENSIONS (FLUIDS); TEMPERATURE; THERMAL CONDUCTIVITY;

CAPILLARY BRIDGES; COMPOSITE JOINT; COPPER PILLARS; ELECTRICAL TRANSPORT; ELECTRONIC PACKAGE; MECHANICALLY STABLE; NANOPARTICLES SUSPENSION; THERMAL; THERMAL TRANSPORT; UNDERFILLS;

ALUMINA;

EID: 84907816375     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4028332     Document Type: Article

References (0)