Synthesis and Characterization of One-Dimensional Cu-Sn Nanowire Diffusion Couples for Nanowire Assembly and Interconnection

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 2329-2334

  Gao, Fan ^a   Yin, Qiyue ^b   Wang, Jirui ^b   Zhou, Guangwen ^a   Gu, Zhiyong ^a  

^a University of Massachusetts   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

Author keywords

Interconnects; Intermetallic Compounds (IMC); Lead free; Nanoelectronics; Nanowires; Soldering

Indexed keywords

DIFFUSION; INTEGRATED CIRCUIT INTERCONNECTS; INTERMETALLICS; LEAD-FREE SOLDERS; NANOELECTRONICS; NANOTECHNOLOGY; NANOWIRES; NETWORK COMPONENTS; OPTICAL INTERCONNECTS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

ELECTRODEPOSITION METHODS; FUNDAMENTAL PRINCIPLES; INTER-METALLIC DIFFUSIONS; LEAD-FREE; MORPHOLOGICAL EVOLUTION; NANOPOROUS TEMPLATES; NANOSCALE INTERCONNECTS; SYNTHESIS AND CHARACTERIZATIONS;

TIN;

EID: 84987784670     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.101     Document Type: Conference Paper

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