Thermal fatigue resistance of the Sn-9Zn-xAg lead-free solders/Cu interface

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 307-312

  Chang, Tao Chih ^a   Hon, Min Hsiung ^a   Wang, Moo Chin ^b   Lin, Dong Yih ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^c I SHOU UNIVERSITY   (Taiwan)

Author keywords

adhesion strength; fracture path; intermetallic compound; lead free solder; Thermal fatigue

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); COPPER COMPOUNDS; FATIGUE OF MATERIALS; FRACTURE; INTERMETALLICS; LEAD; LEAD COMPOUNDS; LEAD-FREE SOLDERS; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SPECTROMETERS; THERMAL CYCLING; THERMAL FATIGUE; TIN ALLOYS; ZINC;

63SN37PB; AG ADDITIONS; ENERGY DISPERSIVE SPECTROMETERS; FRACTURE PATH; PULL-OFF TESTS; SOLDER ALLOYS; X RAY DIFFRACTOMETERS;

TIN;

EID: 84966601414     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188856     Document Type: Conference Paper

References (22)

1. Harris P.G. et al., "The role of intermetallic compounds in lead-free soldering", Soldering & Surface Mount Technology, Vol. 10, No. 3 (1998), pp. 38-52.
2. Lee H.T. et al., "Influence of intermetallic compounds on the adhesion strength of solder joints", Mater. Sci. Eng. A, Vol. 333, (2002), pp. 24-34.
3. Tu, P.L. et al., "Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints", IEEE Trans-CPMT-B, Vol. 20, No. 1 (1997), pp. 87-93.
4. Frear D.R. et al., The Mechanics of Solder Alloy Interconnects, Van Nostrand ReINHOLD (New York, 1994), p. 62.
5. Yu S.P. et al., "Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate", J. Mater. Sci., Vol. 37, (2002), pp. 185-190.
6. Yu S.P. et al., "Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate", J. Mater. Sci. in Elect., Vol. 11, (2000), pp. 461-471.
7. th American Conference on Crystal Growth and Epitaxy, Seattle, WA, August. 2002.
8. Chiou B.S. et al., "Metallurgical Reactions at the Interface of Sn/Pb Solder and Electroless Copper-Plated AIN Substrate", IEEE Trans-CPMT-B, Vol. 18, No. 3 (1995), pp. 537-542.
9. Chang T.C. et al., "Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder", Mater Res. Bullt., revised.
10. Kanchanomai C. et al., "Low cycle fatigue behavior and mechanisms of a eutectic Sn-Pb solder 63Sn/37Pb", Int. J. Fatigue, Vol. 24, (2002), pp. 671-683.
11. Lynch C.T., CRC Handbook of Materials Science, CRC Press Inc. (Florida, 1974), pp. 64-65.
12. Chang T.C. et al., "The interfacial adhesion strength of the Sn-9Zn-xAg/Cu interface", submitted to J. Elect. Mater.
13. Chang T.C. et al., "Thermal Characterization and the Intermetallic Compounds Formed between Cu Substrates and Sn-9Zn-xAg Lead-free Solders", submitted to Metall. Mater. Trans. A.
14. Lee et al., "Thermodynamic Prediction of Interface Phases at Cu/Solder joints", J. Elect. Mater., Vol. 27, (1998), pp. 1161-1166.
15. Suganuma et al., "Wetting and interface microstructure between Sn-Zn binary alloy and Cu", J. Mater. Res., Vol. 13, No. 10 (1998), pp, 2859-2865.
16. 5 intermetallic compound formation at Sn-9Zn-xAg/Cu interface during soldering", Scripta Materialia, revised.
17. 5 formation and growth of intermetallic compounds at Sn-9Zn-xAg/Cu interface during aging process", submitted to J. Cry. Growth.
18. Tu K.N. et al., "Morphology Stability of Solder Reaction Products in Flip Chip Technology", J. Elect. Mater., Vol. 30, No. 9 (2001), pp. 1129-1132.
19. Yu S.P. et al. "Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface", J. Mater. Res., Vol. 16, No. 1 (2001), pp. 76-82.
20. Mei Z. et al., "Analysis of low-temperature intermetallic growth in copper-tin diffusion couples", Metall. Trans. A, Vol. 23, (1992), pp. 857-854.
21. So. A.C.K. et al., "Reliability Studies of Surface Mount Solder Joints - Effect of Cu-Sn Intermetallic Compounds", IEEE Trans-CPMT-B, Vol. 19, No. 3 (1996), pp. 661-668.
22. Chen K.I. et al., "The microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys - the Effect of Ag", J. Elect. Mater., Vol. 31, No. 8 (2002), pp. 861-867.