The potential and realization of multi-layers three-dimensional integrated circuit

2001 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001 - Proceedings

Volumn 1, Issue , 2001, Pages 40-45

  Chan, Mansun ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

3 D Integrated Circuits; recrystallization; Stacked Transistors; Thin Film Transistors; Wafer Bonding

Indexed keywords

EID: 84966565037     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2001.981421     Document Type: Conference Paper

References (14)

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