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Volumn 6, Issue 15, 2016, Pages 12048-12052
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Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
DECOMPOSITION;
FLOW OF GASES;
NITROGEN;
ORGANOMETALLICS;
TEMPERATURE;
COPPER PARTICLES;
ELECTRICALLY CONDUCTIVE;
HIGH PACKING DENSITY;
LOW-TEMPERATURE SINTERING;
METAL ORGANIC DECOMPOSITION;
NITROGEN GAS FLOW;
PRINTED ELECTRONICS;
SINTERING PROCESS;
SINTERING;
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EID: 84957059401
PISSN: None
EISSN: 20462069
Source Type: Journal
DOI: 10.1039/c5ra25058g Document Type: Article |
Times cited : (57)
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References (30)
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