|
Volumn 18, Issue 3, 2012, Pages 493-498
|
Hybrid copper complex-derived conductive patterns printed on polyimide substrates
|
Author keywords
Decomposition; Electrical resistivity; Electronic materials; Powder processing
|
Indexed keywords
COPPER OXIDES;
DECOMPOSITION;
ELECTRIC CONDUCTIVITY;
METALLIC FILMS;
POLYIMIDES;
SINTERING;
SYNTHESIS (CHEMICAL);
ADHESION CHARACTERISTIC;
CONDUCTIVE PATTERNS;
ELECTRONIC MATERIALS;
MECHANOCHEMICAL MILLINGS;
NITROGEN ATMOSPHERES;
PARTICLE SINTERING;
POLYIMIDE SUBSTRATE;
POWDER PROCESSING;
SUBSTRATES;
|
EID: 84863839298
PISSN: 15989623
EISSN: 20054149
Source Type: Journal
DOI: 10.1007/s12540-012-3017-z Document Type: Article |
Times cited : (21)
|
References (18)
|